
Xilinx’s Xcell Journal, Fourth Quarter 2009
This article describes the application of splayed pin fin heat sinks to cutting-edge FPGAs
Read more »Electronic Design, May 2006
The article describes in detail the characteristics and application of splayed pin fin heat sinks
Read more »Embedded Computing, July 2007
The article introduces cooling techniques for embedded systems in low airspeed environments
Read more »New Electronics, June 2009
An introduction to the pin fin technology
Read more »Canadian Electronics, March 2009
The article examines the advantages of copper heat sinks
Read more »EEPN, March 2006
The article outlines a 10 step system that can be used to properly select a pin fin heat sink
Read more »EDN, May 2009
The article examines the impact of pin density on the overall cooling of boards that contain a large number of integrated circuits
Read more »Programmable Logic Design Line, March 2009
A thorough technical paper that looks at cooling FPGAs
Read more »Electronic Products, August 2007
The article introduces the notion of using exotic and odd shaped heat sinks for local hot spots
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