Technology > Technical Articles
- Technical articles written by Cool Innovations technical staff are regularly contributed to leading technical publications
- The articles in this section are helpful to the heat sink selection process
Splayed Design Makes Pin Fin Heat Sinks Cooler
Xilinx’s Xcell Journal, Fourth Quarter 2009
This article describes the application of splayed pin fin heat sinks to cutting-edge FPGAs
Read more »For More Efficient Cooling, Try Splayed Pin-Fin Heatsinks
Electronic Design, May 2006
The article describes in detail the characteristics and application of splayed pin fin heat sinks
Read more »Highly efficient cooling in low-airspeed environments
Embedded Computing, July 2007
The article introduces cooling techniques for embedded systems in low airspeed environments
Read more »Pin fin heat sinks point the way to more efficient cooling
New Electronics, June 2009
An introduction to the pin fin technology
Read more »Cool Running: Copper Heat Sinks
Canadian Electronics, March 2009
The article examines the advantages of copper heat sinks
Read more »Selecting Pin Fin Heat Sinks for Surface Mount Devices
EEPN, March 2006
The article outlines a 10 step system that can be used to properly select a pin fin heat sink
Read more »Selecting heat sinks for heavily populated boards
EDN, May 2009
The article examines the impact of pin density on the overall cooling of boards that contain a large number of integrated circuits
Read more »Innovative Heat Sink Designs Cool "Hot" FPGAs
Programmable Logic Design Line, March 2009
A thorough technical paper that looks at cooling FPGAs
Read more »Tips for selecting heat sinks at the last minute
Electronic Products, August 2007
The article introduces the notion of using exotic and odd shaped heat sinks for local hot spots
Read more »