• Copper and aluminum splayed pin fin heat sinks generate previously unattainable cooling power and low pressure drop
• The cooling premium provided by splayed pin fins stem from a unique structural characteristic they possess: a combination of substantial surface area and a spaciously configured pin array
• This unique characteristic allows heat sinks that possess substantial surface area to still be effective in limited airspeed environments, as weak surrounding air streams are able to flush through the spacious pin array
• Cool Innovations is committed to the provision of custom parts in a cost effective fashion, generally without any tooling or setup charges. Customizable parameters include length, width and height
• Cool innovations' heat sinks are lapped in order to reduce the contact resistance between the heat sink and the device
• Heat Sinks are available with double-sided tape as well as with mechanical attachment methods. For more
• Standard splayed pin fins range from a footprint of 0.54" x 0.54" to a footprint of 2.05" x 2.05" and from a height of 0.3" to a height of 1.1"

Manufacturing Technology

• Pin fin heat sinks for SM devices are manufactured via the Cold Forging process
• The cold forging process allows for the use of highly conductive copper and aluminum alloys
• The cold forging process ensures that no air bubbles, cavities or any other impurities are trapped within the material

Materials

• Aluminum pin fin heat sinks are forged from pure aluminum (AL1100)
• The thermal conductivity of AL 1100 is 1510 btu/in ft2 hr of. (~50% higher than AL 380, a common cast alloy)
• Copper pin fin heat sinks are forged from pure copper (CDA 110)
• The thermal conductivity of CDA 110 is 2712 btu/in ft2 hr of. (~100% higher than AL 380, a common cast alloy)

Base Finish

• Pin fin heat sinks for SM devices are lapped
• The lapping process significantly improves the flatness and the surface finish of the base of the heat sink, when compared to conventional base finishing processes
• The contact resistance between the heat sink and the device is reduced significantly following the completion of the lapping process
• Flatness: Better than 0.001 inch/inch
• Surface Finish: 16 RMS or better
• Heat sinks with a footprint smaller than 0.5" x 0.5" are not lapped

Plating (optional)

• Anodize - black, hard black, clear, red (aluminum)
• Zinc - Black (copper)
• Electroless Nickel (aluminum and copper) and Electrolytic (aluminum and copper)

Attachment Methods - For more

All heat sinks are 6/6 RoHS compliant

• Splayed pin fin heat sinks offer a highly efficient omnidirectional cooling alternative for limited and moderate airspeed environments (0-400 LFM)
• The cooling premium provided by splayed pin fins stems from the unique structural characteristic they possess: a combination of substantial surface area and a sparsely configured pin area
• In low airspeed environments and in the natural convection mode, incoming airstreams are weak and unable to penetrate through dense pin arrays
• By better utilizing available application space, splayed pin fins are able to produce a previously unattainable combination of a large surface area and a sparse configuration
• As a result, incoming weak airstreams are able to penetrate into pin arrays that do possess substantial surface area
• The lower the incoming airstreams, the higher the cooling premium offered by the splayed technology
• The lower pressure drop provided by splayed pin fins is a factor in any given airspeed environment