Heat Sinks for Surface Mount Devices > Moderate Design
- Designed for moderate airspeed environments (100-400 LFM)
- A wide array of copper and aluminum pin fin heat sinks are available for large, mid-sized and miniature SM devices
- A vast array of powerful aluminum pin fin heat sinks are available for challenging cooling scenarios in which space is limited and heat loads are heavy
- The industry's largest selection of copper pin fins for SM devices are suitable for extreme cooling needs and for scenarios that require rapid heat spreading
- Low profile copper and aluminum solutions are available for vertically-constrained applications (standard parts as low as 0.2", custom as low as 0.15")
- Miniature heat sinks, as small as 0.27" x 0.27" x 0.15", are available for small-sized devices
- Cool Innovations is committed to the provision of custom parts in a cost effective fashion, generally without any tooling or setup charges. Customizable parameters include length, width and height
- Cool innovations' heat sinks are lapped in order to reduce the contact resistance between the heat sink and the device
- Heat sinks are available with double-sided tape as well as with mechanical attachment methods. For more
- Solutions range from a footprint of 0.27" x 0.27" to a footprint of 2.05" x 2.05" and from a height of 0.15" to a height of 1.1".
- Pin fin heat sinks for SM devices are manufactured via the Cold Forging process
- The cold forging process allows for the use of highly conductive copper and aluminum alloys
- The process ensures that no air bubbles, cavities or any other impurities are trapped within the material
- Aluminum pin fin heat sinks are forged from pure aluminum (AL1100)
- The thermal conductivity of AL 1100 is 1510 btu/in ft2 hr of. (~50% higher than AL 380, a common cast alloy)
- Copper pin fin heat sinks are forged from pure copper (CDA 110)
- The thermal conductivity of CDA 110 is 2712 btu/in ft2 hr of. (~100% higher than AL 380, a common cast alloy)
- Pin fin heat sinks for SM devices are lapped
- The lapping process significantly improves the flatness and the surface finish of the base of the heat sink, when compared to conventional base finishing processes
- The contact resistance between the heat sink and the device is reduced significantly following the completion of the lapping process
- Flatness: Better than 0.001 inch/inch
- Surface Finish: 16 RMS or better
- Heat sinks with a footprint smaller than 0.5" x 0.5" are not lapped
- Anodize - black, hard black, clear, red (Aluminum)
- Zinc - Black (Copper)
- Electroless Nickel (Aluminum and Copper) and Electrolytic Nickel (Aluminum and Copper)
Manufacturing Technology
Materials
Base Finish
Plating (optional)
Attachment Methods - For more
All heat sinks are 6/6 RoHS compliant
- Cool Innovations developed highly sophisticated and flexible manufacturing processes that allow for a high degree of customization
- The moderate design is highly suitable for custom applications due to its symmetric pin fin nature
- The majority of custom operations do not involve any tooling charges and have no impact on lead times
- Any required square of rectangular configuration is feasible
- Any required height between 0.15" to 1.1" is possible
- Single or multiple pins can be eliminated
- Any standard secondary operations are available (e.g. holes, threads, notches, etc.)
