Heat Sinks for Power Devices > Sparse Design

Designed for low airspeeds and natural convection cooling (0-400 LFM)
A widely spaced pin configuration allows for efficient cooling in low airspeed environments

Sparsely configured pin fin heat sinks generate substantial cooling power in limited airspeed environments
The sparse pin fin configuration allows weak incoming air streams to efficiently enter and exit the pin array, thus providing efficient cooling in low airspeed environments
Cool Innovations is committed to the provision of custom parts in a cost effective fashion, generally without any tooling or setup charges. Customizable parameters include length, width and height
Cool innovations' heat sinks are lapped in order to reduce the contact resistance between the heat sink and the device
Sparsely configured pin fin heat sinks range from a footprint of 2.40" x 2.40" to a footprint of 5.00" x 5.00" and from a height of 0.6" to a height of 1.0"

Sparse pin fin heat sinks for Power devices are manufactured via the Cold Forging process
The cold forging process allows for the use of highly conductive aluminum alloys
The process ensures that no air bubbles, cavities or any other impurities are trapped within the material

Aluminum pin fin heat sinks are forged from pure aluminum (AL1100)
The thermal conductivity of AL 1100 is 1510 btu/in ft2 hr of. (~50% higher than AL 380, a common cast alloy)

Pin fin heat sinks for SM devices are lapped
The lapping process significantly improves the flatness and the surface finish of the base of the heat sink, when compared to conventional base finishing processes
The contact resistance between the heat sink and the device is reduced significantly following the completion of the lapping process
Flatness: Better than 0.001 inch/inch
Surface Finish: 16 RMS or better

Techical Support

Contact our industry leading team at (905)760-1992