Heat Sinks for Embedded Devices > Embedded Intel
- Copper and aluminum pin fins are available for Mobile & Embedded Intel CPUs
- Designed for Socket 479, Socket M, Socket P and Micro-FCBGA
- A versatile array of powerful copper and aluminum heat sinks are available for mobile and embedded Intel CPUs
- Available solutions are designed for space constrained applications and for low airspeed cooling
- Solutions are available in three distinct designs, each optimized for a specific airspeed environment
- Cool innovations' heat sinks are lapped in order to reduce the contact resistance between the heat sink and the device
- Solutions range from a footprint of 2.00" x 2.00" to a footprint of 3.0" x 2.2" and from a height of 0.3" to a height of 1.1"
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