Heat Sinks for Embedded Devices > Moderate Design
- Designed for moderate airspeed environments (100-400 LFM)
- A large array of copper and aluminum/copper hybrid heat sinks are available for single and multiple-device cooling
- A large array of moderate pin fins are available for challenging cooling scenarios in which space is limited and heat loads are heavy
- Solutions are available in two material variations, copper and a hybrid of copper and aluminum, both possess outstanding cooling properties
- Copper pin fins for embedded devices are composed of multiple forged copper pin fin heat sinks that are joined via the high temperature brazing process
- Hybrid pin fins are composed of multiple forged aluminum pin fins that are reflowed onto a copper plate
- Both copper and aluminum/copper moderate pin fins are highly suitable for vertically-constrained applications, with available solutions as low as 0.2"
- Cool Innovations is committed to the provision of custom parts in a cost effective fashion, generally without any tooling or setup charges. Customizable parameters include length, width and height
- Cool innovations' heat sinks are lapped in order to reduce the contact resistance between the heat sink and the device
- Solutions range from a footprint of 3.00" x 1.50" to a footprint of 8.20" x 8.20" and from a height of 0.20" to a height of 1.30"
- Hybrid pin fins for embedded devices are composed of multiple forged aluminum pin fins that are reflowed onto a copper plate
- Combining the forging and reflow processes enables Cool Innovations to provide pin fins with very large footprints
- Available solutions generate exceptional cooling power and outstanding heat spreading attributes for vertically constrained applications
- Hybrid pin fins provide the heat spreading attributes of copper heat sinks, yet are significantly lighter
- Copper pin fins for embedded devices can be easily customized to meet application specific requirements
- Solutions range from a footprint of to a footprint of 3.00" x 1.50" to a footprint of 6.10" x 4.10" and from a height of 0.2" to a height of 1.3"
- Copper pin fins for embedded devices are composed of multiple forged copper pin fin heat sinks that are joined via the high temperature brazing process
- Combining the forging and brazing processes enables Cool Innovations to provide pin fins with very large footprints
- Available solutions generate exceptional cooling power and outstanding heat spreading attributes for vertically constrained applications
- Copper pin fins for embedded devices can be easily customized to meet applications specific requirements
- Solutions range from a footprint of to a footprint of 3.00" x 1.50" to a footprint of 8.20" x 8.20"and from a height of 0.2" to a height of 1.3"
Weight an issue?
Hybrid pin fins offer the spreading power of copper heat sinks, yet are significantly lighter