Heat Sinks for Fansinks – Integrated Configuration

Heat Sinks for Fansinks > Integrated

Integrated fansinks offer substantial cooling power in a low profile envelope
Designed for PCI Express applications (0.42" height) & ATCA applications (0.63" height)

Integrated fansinks are composed of a pin fin heat sink and a fan that is embedded into the pin array
Due to their unique structure integrated fan sinks offer extreme low profile fansink solutions
Integrated fansinks are a great fit for PCI Express applications (0.42" height) & ATCA applications (0.63" height) and for other low profile applications
Integrated copper fansinks are highly suitable for extreme cooling needs and for scenarios that require rapid heat spreading
Integrated aluminum fansinks are designed for the majority of cooling scenarios
Overall height can be modified to fit application specific requirements
Lapped in order to reduce the contact resistance between the heat sink and the device
Available with double-sided thermal tape
Fan information: High reliability bracket fan, 6.1 CFM, 12V, 0.2 AMP
Heat sinks are supplied with the fan installed
Integrated fan sinks range from a footprint of 1.81" x 1.81" to a footprint of 4.10" x 2.05"and from a total height of 0.42" to a total height of 0.63"

Aluminum pin fin heat sinks for fan sinks are manufactured via the Cold Forging process
The cold forging process allows for the use of highly conductive aluminum and copper alloys
The process ensures that no air bubbles, cavities or any other impurities are trapped within the material

Aluminum pin fin heat sinks are forged from pure aluminum (AL1100)
The thermal conductivity of AL 1100 is 1510 btu/in ft2 hr of. (~50% higher than AL 380, a common cast alloy)
Copper pin fin heat sinks are forged from pure copper (CDA 110)
The thermal conductivity of CDA 110 is 2712 btu/in ft2 hr of. (~100% higher than AL 380, a common cast alloy)

Pin fin heat sinks for fansnks are lapped
The lapping process significantly improves the flatness and the surface finish of the base of the heat sink, when compared to conventional base finishing processes
The contact resistance between the heat sink and the device is reduced significantly following the completion of the lapping process
Flatness: Better than 0.001 inch/inch
Surface Finish: 16 RMS or better

Anodize - black, hard black, clear, red (Aluminum)
Zinc - Black (Copper)
Electroless Nickel (Aluminum and Copper) and Electrolytic Nickel (Aluminum and Copper)