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UltraCool III Heat Sinks for SM Devices |
- Forged copper pin fin heat sinks.
- Designed for heavy heat loads, space-constrained applications & low airspeed environments.
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UltraCool IV Heat Sinks for SM Devices |
- Forged copper pin fin heat sinks.
- Designed for extreme cooling needs, for space-constrained applications and for devices that contain small and focused heat sources.
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UltraCool Heat Sinks for CPUs |
- Aluminum and copper pin fin heat sinks.
- Suitable for embedded systems, single card applications and desktops.
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UltraCool II Heat Sinks for Through-Hole Devices |
- Aluminum pin fin heat sinks.
- Suitable for board level devices that dissipate heavy heat loads and for space-constrained applications.
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UltraCool II Heat Sinks for Power Modules |
- Aluminum pin fin heat sinks.
- Suitable for power modules that dissipate heavy heat loads and for space-constrained applications.
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UltraPack Heat Sinks for Integrated Power Devices |
- A unique cooling solution for integrated power devices (e.g. power amplifiers).
- The UltraPack concept involves direct insertion of pins into an application’s housing.
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