UltraCool II heat sinks are designed for board level devices that dissipate heavy heat loads and for space-constrained applications.
UltraCool II heat sinks for through-hole devices can be customized to mount any number of devices.
Key Features
Outstanding cooling power
Easily tailored to mount any number of devices
Ideal for space-constrained applications
Suitable for heavy thermal loads
The UltraCool Advantage
UltraCool pin fin heat sinks outperform most other heat sink technologies by a substantial margin.
The pin fin structure produces very low thermal resistances per given volume due to the round nature of the pins, large surface areas and an omnidirectional design.
UltraCool heat sinks are manufactured using highly conductive aluminum alloys.
Structure
Three standard heat sink structures are available:
U-Shape - Designed for mounting of pairs of TO-220s, TO-247s and similar components. The components are mounted on the "side walls" of the heat sink.
T-Shape - Designed to mount multiple components on a single heat sink. The components are mounted on the "leg" of the "T".
Compacts - Designed to mount single components using threads or through- holes.
Physical Specifications
Dimensions
Footprint
Height
Min
1.00" x 0.75"
0.50"
Max
2.00" x 6.00"
1.7"
Pin Configurations
Two pin configurations are available. Each configuration is designed to operate optimally in a specific airspeed range.
Configuration
Description
Airflow Min
Airflow Max
M
Low Pin Density
0*
300*
R
High Pin Density
300*
700*
*Airflow is expressed in LFM (Linear Feet per Minute).
Customization
“U” & “T” dimensions can be customized for applications specific requirements.
Mounting holes, threads and any other secondary operations.
The majority of alterations do not require any tooling charges.
