The industry leading UltraCool family of pin fin heat sinks provides outstanding cooling solutions for SM Devices.
UltraCool III heat sinks (aluminum) are designed for SM devices that dissipate heavy heat loads, for space-constrained boards and for applications that are restricted by low airspeeds.
UltraCool IV heat sinks (copper) are designed for extreme cooling needs and for devices that contain small and focused heat sources.
UltraCool heat sinks - designed for BGA, PBGA, PGA, PPGA, PLCC and flip chips - are also suitable for any other SM packages.
Key Features
Outstanding cooling power
Low pressure drop
Easily tailored to any footprint or height
A wide array of standard solutions
The UltraCool Advantage
UltraCool Pin fin heat sinks outperform most other heat sink technologies by a substantial margin.
The pin fin structure produces very low thermal resistances per given volume due to the round nature of the pins, large surface areas and an omnidirectional design.
UltraCool pin fins are offered in three different configurations. Each configuration is designed for a specific airspeed range. The selection of a proper configuration ensures that surrounding airflows are optimally used to further enhance peformance.
UltraCool heat sinks are forged from highly conductive aluminum and copper alloys.
The UltraCool Product Family
UltraCool III pin fin heat sinks - Forged from pure aluminum.
