Forged out of oxygen-free copper, UltraCool IV heat sinks provide exceptional cooling power.
UltraCool IV heat sinks are suitable for devices that generate heavy heat loads, for devices that contain small and focused heat sources and for space-constrained applications.
Due to the highly conductive nature of oxygen-free copper, UltraCool IV heat sinks offer the functionalities of both a heat sink and a heat spreader.
Key Features
Exceptional cooling power
Outstanding heat spreading abilities
Function as a heat sink and a heat spreader
Suitable for extremely hot devices
Suitable for small and focused heat sources
Ideal for open flip-chip devices
Physical Specifications
Dimensions
Footprint
Height
Min
0.25" x 0.25"
0.15"
Max
2.00" x 2.00"
1.1"
Customization
Ultracool IV heat sinks can be customized to any height.
UltraCool IV heat sinks can be customized to any footprint.
The majority of alterations do not require any tooling or setup charges.
Pin Configurations
Two pin configurations are available. Each configuration is designed to operate optimally in a specific airspeed range.
Configuration
Description
Airflow Min
Airflow Max
M
Low Pin Density
0*
150*
U
Moderate Pin density
150*
500*
*Airflow is expressed in LFM (Linear Feet per Minute).
Pre-applied thermal tape. Suitable for metal, ceramic and plastic packages.
Mounting holes, threads and any other secondary operations.
Manufacturing Technology & Metallurgy
UltraCool IV heat sinks are forged out of oxygen-free copper, a highly conductive copper alloy that enhances both the heat sink’s cooling properties and its heat spreading abilities.
Oxygen-free copper is up to 200 percent more conductive than AL 380 (a common casting alloy) and up to 100 percent more conductive then AL6061 (a common extrusion alloy).
The nature of the cold forging process ensures that no air bubbles, cavities or any other impurities will exist within the product or on its exterior.
