Forged out of pure aluminum, UltraCool III pin fin heat sinks provide outstanding cooling solutions for SM devices.
UltraCool III heat sinks are designed for situations in which substantial cooling power is required and for applications in which the space available for cooling is limited.
The UltraCool III line offers a wide array of solutions for any package type and size.
UltraCool III heat sinks can be customized to any required footprint or height in a cost effective fashion.
Key Features
Outstanding cooling power
Low pressure drop
Easily tailored to any footprint or height
A wide selection
Powerful low airspeed solutions
Unique miniature solutions
Physical Specifications
Dimensions
Footprint
Height
Min
0.25" x 0.25"
0.15"
Max
2.50" x 2.50"
1.7"
Customization
Ultracool III heat sinks can be customized to any height.
UltraCool III heat sinks can be customized to any footprint.
The majority of alterations do not require any tooling or setup charges.
Pin Configurations
Three pin configurations are available. Each configuration is designed to operate optimally in a specific airspeed range.
Configuration
Description
Airflow Min
Airflow Max
M**
Low Pin Density
0*
150*
U
Moderate Pin density
150*
400*
R
High Pin density
400*
600*
*Airflow is expressed in LFM (Linear Feet per Minute).
**Part numbers ending with an M.
Pre-applied thermal tape. Suitable for metal, ceramic and plastic packages.
Mounting holes, threads and any other secondary operations.
Manufacturing Technology & Metallurgy
UltraCool III heat sinks are forged from pure aluminum, a highly conductive alloy that is up to 100 percent more conductive than AL 380 (a common casting alloy), and up to 40 percent more conductive then AL6061 (a common extrusion alloy).
The nature of the cold forging process ensures that no air bubbles, cavities or any other impurities will exist within the product or on its exterior.
