Mechanical clips are available for both UltraCool III and UltraCool IV heat sinks. The clips are suitable for high-reliability applications.
UltraCool heat sinks for SM devices are offered with pre-applied double-sided thermal tape.
Through-holes, tapped holes and other secondary operations, for mounting purposes, are also available.
Mechanical Attachment Solutions
Cool Innovations offers two mechanical attachment clip lines, the SM and TH lines. Straight and diagonal clips are available in each line.
The SM and TH solutions are suitable for high-reliability applications. They do not contain any bonding agents or organic substances.
Both mechanical solutions are structured in a fashion that minimizes any interference with surrounding airflow.
Pre-applied phase change interface materials (substitute to grease) are available for all clip assemblies.
SM Clips
SM clips are stamped from stainless steel. These slightly curved perforated strips are generic for each heat sink size, and can accommodate any component height or PCB thickness.
The clip is positioned on top of the heat sink’s base, through the middle row of pins. It is then screwed to two standoffs that are set on the board, adjacent to the device.
The standoff height is determined by the chip height and the required hold-down force.
SMDL Clips
Similar to SM clips, but placed diagonally on the heat sink.
TH Clips
Formed from beryllium copper, the TH clips are a one-piece solution. The TH clip is positioned on top of the heat sink's base and then is snapped into two obroud slots in the PCB, adjacent to the device.
TH clips are applications specific and are produced to fit the component height, PCB thickness & desired hold-down force.
THDL Clips
Similar to SM clips, but placed diagonally on the device.
Thermally Conductive Tapes
UltraCool heat sinks for SM devices are offered with pre-applied double-sided thermally conductive adhesive tapes.
Tapes are available for metal, ceramic and plastic packages.
The dimensions and location of the pad can be altered to meet non-standard application-specific requirements.
